Ready-to-use paste with SnAgBi57,6
(LEADFREE)
ISO-9454: 3124 (3.1.2.A)
Pictures may differ from the original.
Application area: | Conventional soft soldering of steel, stainless steel, copper and brass materials |
Metal alloy: | Sn42Bi57,6 |
Particle size: | < 80 μ |
Metal portion: | > 70% |
Flux portion: | < 30% |
Flux type: | 3124 (3.1.2.A) |
In case of soldering and tinning pastes, the metallic components will always separate from the combination of carrier plus flux and settle at the bottom of the delivery container after a longer period of time. If this settling behaviour is not recognised or ignored by the user and therefore the can contents are not stirred, faulty solder joints are inevitable. The EO soft solder paste has a special use indicator that clearly shows you that homogenisation is essential:
When the metallic components separate from the carrier and settle, the colour of the paste surface changes from “metallic silvery-grey” to “R E D”. To restore the paste to a usable state, it is now absolutely necessary to stir it with a stainless steel or wooden spatula until the red colour changes back to silvery-grey.
Questions about our products?
We will advise you by phone 06123 / 7046-0.